| LEADER | 00917nam 22003134a 4500 | |
| 008 | 070528s2005 ohum b a001 0 eng
|
| 016 | |
| 020 | |
| 040 | | |a DLC |c DLC|d BAKER |d TH-BaPIT |
|
| 050 | | 00 |a TK7870.15 |b .L434 2005 |
|
| 222 | |
| 245 | | 00 |a Lead-free solder interconnect reliability / |c edited by Dongkai Shangguan. |
|
| 260 | | |a Materials Park, OH : |b ASM International, |c 2005. |
|
| 300 | |
| 650 | | 0 |a Microelectronic packaging |x Reliability. | | 0 |a Solder and soldering. | | 0 |a Lead-free electronics manufacturing processes. |
|
| 700 | | 1 |a Shangguan, Dongkai,|d 1963- |
|
| 930 | | |a งปม. |d 25/05/50 |h 8,800 บาท |
|
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